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 According to Memes Consulting, the Fraunhofer Institute for Silicon Technology (ISIT) in Germany announced the use of the PICOSUN P-300B ALD system for its PowderMEMS technology platform. PICOSUN P-300B ALD and its features PowderMEMS from Fraunhofer ISIT is a new innovative technology for creating three-dimensional microstructures from a variety of materials at the wafer level. The technology is based on bonding micron-sized powder particles together in cavities through an atomic layer deposition (ALD) process. PowderMEMS has many advantages over other fabrication techniques because it allows the use of much lower process temperatures than traditional sintering processes. The bonded porous structure is thermally and chemically resistant, allowing extensive post-processing in cleanrooms. PowderMEMS technical specifications "PowderMEMS can be used in a variety of MEMS applications, including sensors, actuators, energy harvesters, microfluidics, microelectronics, etc....

 Flip-chip interconnection technology has been widely used in high-performance and consumer electronics. High-performance packaging has achieved steady development, realizing the interconnection with more than 10,000 I/Os and a pitch of less than 200um, realizing the transition from ceramic substrates to low-cost organic substrates, and achieving the popularization of lead-free solder pastes. The transition to organic substrates has prompted low-temperature solder pastes to replace high-temperature solder pastes. As we all know, organic materials are usually epoxy resins, which are unstable at temperatures above 250°C for a long time. One way to avoid this problem is to deposit a low-temperature solder paste on the high melting point bump or the laminate pad. As shown in the figure below, the high melting point solder bumps are interconnected with the low-temperature solder pastes on the pads. This combination allows for the assembly of chips and laminate substrates a...

 In recent years, flip-chip technology has been increasingly adopted in consumer electronics and high-performance products. During flip-chip packaging, lead-free solder paste can be used for substrate bumping, modules, and board level connections, etc. What kind of lead-free solder paste should be selected in practical applications? Considering the process characteristics in combination with your own situation Due to the properties of lead-free solder paste, there are contradictions that need to be chosen among the characteristics of lead-free solder paste, which makes it impossible to have a perfect product. Solder paste needs to be selected according to process characteristics. For example, when the alloy solder is selected, it is necessary to boost the activity of the solder flux to increase the wettability of the solder paste on the surface of the metals. However, the increase in the activity may produce more flux residues, which can corrode the metal surface afte...

  1. The hazards of solder balls There are solder balls with sizes about 0.2mm~0.4mm, or some exceed this range, which is mostly concentrated around chip RC components. The existence of solder balls not only affects the appearance of electronic products but also brings hidden dangers to product quality. Due to the high density and fine pitch of modern printed circuit board components, the solder balls are easy to lift off when using, resulting in short circuits and affecting the quality of electronic products. Therefore, it is very important to understand the causes and control of solder balls. 2. The reason why solder paste turns to solder balls Generally speaking, there are many reasons for the generation of solder balls, such as the thickness of the printing solder paste, the composition and oxidation of the solder paste, the production and aperture of the stencil, the water absorption of the solder paste, the mounting pressure of the components, the soldering perf...

 The chip semiconductor industry has developed vigorously in recent years, and the supporting industries related to microelectronics and semiconductor packaging have achieved unprecedented development. Various companies have sprung up, including the packaging solder industry of solder paste as well. Semiconductor packaging companies hope to find suitable and reliable solder paste products to meet their needs and ensure the performance and reliability of the products. What aspects should companies consider when choosing solder paste products and manufacturers? 1. How to choose a suitable solder paste? 1. Determining the needs Companies should determine what requirements the solder paste needs to meet according to the characteristics of their products (such as type, size, service temperature, manufacturing process, application scenario, etc.), such as solder paste melting point, reflow temperature, time, printing or dispensing process, cleanability, electrical conductiv...

 As an extremely important part of solder paste products, flux affects important properties such as the performance and reliability of solder paste. The base material is one of the main components of the solder paste flux. What are the functions of the base material in the solder paste flux? What are the commonly used base materials of the flux? How does it work? The base material for solder paste flux has the functions: (1) Cooperate with the solvent in the flux to enhance solder paste tackiness, keeping the mechanical position of the component after mounting. (2) The combined action of the base material, solvent, thixotropic agent, etc., ensures the good printing performance of the solder paste; (3) The base material in flux is the carrier of the solder alloy powder, and it also has a certain soldering cleaning effect. Common materials and mechanism of the flux carrier: Natural rosin, modified rosin, artificial resin, and so on are often used as the flux carrier, whic...

  SAC305 is a common medium-high-temperature solder commonly used in secondary reflow soldering. SAC305 has high conductivity and soldering strength, which can meet the usage requirements of most microelectronic products. The main factor affecting the soldering strength of SAC305 is the growth of intermetallic compounds (IMCs). IMCs nucleate and grow due to interface reactions during soldering and aging, and their brittleness may reduce the strength of the solder joints. SiC is a ceramic material with unique chemical stability and ultra-high melting point and possesses excellent electrical, mechanical, and thermal properties. Many studies have shown that SiC particles can be refined β- Sn and IMCs play a role in enhancing solder joints. SAC305-SiC solder Pal et al. chose to combine a small amount of SiC (1-3μm) And SAC305 (20-24μm) The alloy powder is mixed, and reinforced solder is prepared by planetary ball milling process. The solder is prepared by stirring at room temperature a...