SZFitech

  As the most prestigious annual event in the semiconductor industry across Southeast Asia, SEMICON SEA 2025 will take place at the Singapore Sands Convention and Exhibition Centre from May 20–22, 2025. SZ FItech, a leading global supplier of soldering materials, a dedicated key player in the microelectronics and semiconductor packaging field for over 20 years, will showcase four innovative products and solutions, including FWS305 water-soluble solder paste. These products are manifestation of SZ F i tech 's technological accumulation over the years and will facilitate to bring breakthrough solutions to the global advanced packaging field, supporting technological upgrade and development of advanced packaging.   We sincerely invite all semiconductor professions from around the world to visit our booth B1423 , exchanging information and sparking inspiration on the latest developments in packaging technology, innovative applications of materials, and market tre...

 Non-wetting refers to the soldering process, the solder fails to adequately cover the surface of the substrate pads or device pins, resulting in the formation of a large contact angle between the solder and the base metal (usually > 90 °), and did not form an effective metallurgical bonding phenomenon.The typical characteristics of the solder joint surface showing the base metal colour (such as copper, nickel), the solder is only partially attached or a ball-shaped aggregation (shown in Figure 1-1).This problem directly affects the mechanical strength, thermal cycle reliability and long-term stability of the solder joint. Figure 1-1 Non-wetting 1. the formation mechanism and core causes The essence of non-wetting is that the interface reaction between the solder and the base metal is blocked, the specific causes can be divided into the following four categories: Abnormal state of the substrate metal surface Oxidation and contamination: pad or pin surface oxide ...