SZFitech

 In surface mount technology (SMT) production processes, solder paste inspection (SPI) and automatic optical inspection (AOI) serve as two core quality control technologies. Through their distinct functions and collaborative efforts, they jointly establish an efficient quality assurance system. Detection, Positioning, and Functional Features SPI focuses on post-solder paste printing quality inspection, with its core function being the precise control of solder paste printing quality. Through laser scanning or optical imaging technology, SPI can accurately measure critical parameters such as solder paste thickness, area, volume, and offset, effectively identifying printing defects like under-pasting, over-pasting, misalignment, and short circuits. This early detection prior to component placement prevents defective products from entering subsequent processes, thereby reducing quality risks at the source. AOI primarily handles quality inspection after component placem...

 The process application of laser solder paste needs to be based on environmental control as the cornerstone, through the construction of "temperature - humidity - cleanliness" trinity of precision management system, combined with dynamic parameter adjustment and process adaptation, in order to achieve the quality of welding from "qualified" to "excellent" leap. "Excellence". The following is an in-depth analysis of the four dimensions of technical principles, implementation points, risk avoidance, case evidence: I. Temperature control: precise management of the whole chain from "storage - rewarming - use". 1. Storage temperature: "double insurance" of refrigeration and sealing. Unopened solder paste: need to be refrigerated in 0~10℃ special refrigerator, avoid direct sunlight and high temperature environment. If the temperature has been completed but not used, need to be refrigerated again to prevent flux activ...

 In electronics manufacturing and PCB (Printed Circuit Board) production process, the pads do not tin and through-hole is a common process defects, may be caused by design, materials, process or environmental factors. This article will systematically sort out the root causes of these two types of problems from a technical point of view and provide targeted solutions. I. the five core reasons why the pads do not go on the tin Surface contamination and oxidation Oil, fingerprints or dust: hand contact or environmental dust adhesion will form an insulating layer, preventing solder infiltration. Oxide layer: Copper foil exposed to the air is prone to generate copper oxide, which needs to be protected by chemical immersion gold (ENIG), OSP and other processes. Solution: Strict clean room management, plasma cleaning or chemical cleaning to remove contaminants before soldering. Solder pad design defects Too small size: the width of the pad is not wide enough to form a rel...

 SAC305 has been widely used as a substitute for lead solder on the market. The reliability of SAC305 has always been a concern in the industry. It is known that the formation of intermetallic compounds (IMCs) layer between SAC305 and substrate is an important factor significantly affecting the reliability of solder joints. The methods to reduce the formation of IMC layers include using rapid heating and shortening the holding time during reflow soldering. In addition, research has found that using microwave energy can achieve faster and more uniform heating than reflow soldering, which is called microwave hybrid heating technology (MHH). Compared with traditional reflow soldering, solder joints produced using MHH technology exhibit higher strength and better corrosion resistance. In addition, to meet some low-temperature soldering needs, using nanoscale solder materials will be an alternative to traditional low-temperature solders. Therefore, SAC305 nano-solder has a...