SZFitech

  When selecting anisotropic conductive adhesives (ACA) suitable for specific products, Fitech leverages technological innovation and industry expertise to deliver high-performance solutions for ultra-fine pitch connections, flexible electronics packaging, and high-frequency signal transmission. Key advantages include: I. Ultra-Fine Pitch Interconnects: Nanoscale Conductive Particles Push Boundaries Fitech's proprietary sub-micron conductive particles (500-2000nm gold/silver-coated) enable reliable connections at pitches below 30μm, meeting high-density demands for advanced packaging (e.g., COF, SiP). Core innovations include: Flat Design: Maximizes particle contact area with resistivity as low as 10⁻⁴ Ω·cm, significantly enhancing high-frequency signal (5G, RF) transmission efficiency. Core-Shell Structure: Metal-coated polymer cores reduce density and improve dispersion, balancing cost and performance while optimizing conductive pathways. II. Flexible Elec...

  1. What is package on packaging (PoP) With the development of semiconductor-integrated technology, the electronic products in the current market, such as mobile phones, computers, and electronic watches, are small and portable, with excellent electrical performance and low prices. The development of packaging technology is one of the key factors to improve performance and reduce the price of electronic products. PoP is an effective solution for chip packaging. PoP is made by overlaying two or more packages vertically, which is essentially a 3D overlay technology. The bonding between PoP layers is completed by the use of BGA solder balls. The solder balls can realize the electrical and thermal paths between layers. There can be many types of packages for the PoP product. The bottom package can be a processor, and the package placed on the processor can be a memory. Figure 1. An example of POP structure. 2. Pad printing process of solder paste In order to ...