SZFitech

 The phenomenon of half-wetting, especially the similar behaviour of water on greasy surfaces observed during soldering, as shown in Figure 1-1, is indeed a complex and noteworthy problem.This phenomenon usually involves a number of aspects such as the solderability of the base metal, the presence of contaminants, the activity of the solder paste, and the formation of intermetallic compounds.The following is a detailed analysis of the causes of the formation of the half-wetting phenomenon: Figure 1-1 Semi-wetting phenomenon Poor and uneven solderability of the base metal: Solderability is the ability to form a good metallurgical bond between the metal surface and the solder.If the solderability of the base metal is poor, then the wetting of the solder on its surface will be impaired. Uneven solderability means that some areas of the metal surface bond to the solder more readily than others, which can result in the solder collecting in some areas and not wetting effecti...

 Pad and Via play different roles in electronics manufacturing and PCB (Printed Circuit Board) design, and the main differences between them are in definition, principle, function and design details.The following is a detailed comparison of the two: I. Definition Pad: pad is the basic unit of surface mount assembly, used to constitute the circuit board pad pattern (land pattern), that is, a variety of special component types designed for the combination of pads.Pad is divided into pin pads and surface mounted pads, where the pin pads have weld holes, mainly used for welding pin components; and surface mounted pads do not have weld holes, mainly used for welding surface mounted components, located on the surface of the PCB. Through-hole: through-hole, also known as metallised holes, is an important component in the manufacture of PCBs.In the double-sided board and multilayer board, in order to connect the printed wires between the various layers, in the various layers...

 Failure management after solder paste mixing is a key quality control aspect. The following is a detailed analysis and summary of failure management after solder paste mixing: I. Failure time management Routine expiration time: At room temperature (20~25°C), the stirred solder paste is recommended to be used up within 48 hours. Special solder pastes may have a longer open time, but the specifics need to refer to the technical specifications and data sheets provided by the manufacturer. Factors affecting the expiry time: Solder Paste Composition: Lead-free solder pastes may be more susceptible to failure compared to leaded solder pastes because the composition is more sensitive to environmental and storage conditions. Ambient Temperature: High temperatures accelerate the flux evaporation and oxidation process, resulting in faster paste failure. Ambient humidity: Excessive humidity can cause solder paste to absorb moisture, affecting soldering performance and paste stabil...

 Tin whisker growth has been a major concern in electronics manufacturing.At room temperature, thin, sharp whiskers often appear on the surface of tin coatings, which not only affect the appearance of the product, but can also cause short circuits and lead to equipment failure.In this paper, we will discuss the growth characteristics of room temperature tin whiskers, analyse the differences in their performance on different substrate materials, and propose effective prevention and control strategies. I. Growth characteristics of room temperature tin whiskers The growth of room temperature tin whiskers is mainly in a straight line, but sometimes in a curved form.Figure 1-1 shows the rapid growth of tin whiskers on a Cu-based surface tin layer without accelerating factors (only at room temperature of about 25°C).The formation of these whiskers is due to the reaction between the Sn layer and the Cu interface to form Cu6Sn5 compounds, which leads to volume expansion and i...

 The problem of burrs and tarnish after solder paste soldering can be caused by a variety of factors, here are some specific solutions: I. For the burr problem Choose the right solder paste: The viscosity of solder paste is one of the key factors affecting soldering quality.If the viscosity of solder paste is low, it may lead to burrs on the edges after soldering.Therefore, solder paste with the right viscosity should be selected to ensure soldering quality. If the solder paste is found to have quality problems, such as uneven particles and the presence of impurities, it may also lead to burrs.In this case, the solder paste supplier should be communicated with to replace the solder paste with better quality. Optimising stencil quality: The roughness of the stencil aperture wall has a significant impact on solder quality.If the aperture wall of the stencil is rough, it may result in the solder paste not being evenly distributed during the printing process, thus creatin...

 In the domestic solder paste market, many brands bloom, each with its own speciality.The following is an introduction to some well-known solder paste brands: Fitech Fitech Industrial Technology Co., Ltd, as a leader in the field of microelectronic soldering materials, focuses on the research and development and production of ultramicro solder paste products, its ultramicro solder paste, ultramicro solder adhesive, conductive adhesive, laser solder paste, water-soluble solder paste products are also highly regarded. Fitech has a complete product line, ranging from alloy solder powder to ultra-micro soldering application products. Its solder paste products are widely used in microelectronics and semiconductor packaging, and have been recognised by many customers worldwide. Fitech is also committed to the development and production of environmentally friendly products, and constantly improves its processes, making a positive contribution to the protection of our enviro...

 Solder leakage is an important part of electronic manufacturing, and its quality directly affects the subsequent soldering effect and product reliability.As a common problem in the solder paste printing process, solder leakage not only reduces the soldering quality of the product, but also may lead to the failure of the whole product.The following is a brief discussion of the solder leakage phenomenon in the solder paste printing process: I. The main reasons for leakage welding Leakage of flux spraying: The flux fails to be evenly sprayed or certain areas are missed, resulting in poor soldering. Solder paste leakage printing, less tin: the quality of tin paste after continuous printing degradation, stencil opening design is not appropriate, the size of the paste particle size selection is too large or improper printing parameters, resulting in poor tin under the SPI is not detected, and ultimately poor soldering. Pad oxidation: The oxide layer formed after long time e...

 To effectively reduce the cost of using solder paste, you can start from the following aspects: I. choose the right solder paste products Cost-effective considerations: When choosing a solder paste, do not blindly pursue the low price, but to ensure that the premise of welding quality, choose a cost-effective solder paste. This requires a full understanding and comparison of different brands and models of solder paste. Manufacturer service: Consider the service quality of the solder paste manufacturer, including technical support, after-sales service and so on. High-quality manufacturer services can ensure that the problems encountered in the use of solder paste in the process of timely resolution, thereby reducing the increase in costs due to improper use or quality problems. II. optimise the use of solder paste process Precise control: By upgrading the soldering process, precise control of the solder joint position, reduce the omission and waste of solder paste. For...

 Solder paste creeping tin for printing quality and soldering effect is critical.To improve the solder paste in the soldering process to climb the tin, you can start from the following aspects: 1. the paste selection and processing Solder paste composition and quality: Select the solder paste containing high activity flux, which helps to improve the effect of climbing tin. Ensure that the solder paste has not expired, to avoid the use of expired solder paste caused by the decline in flux activity. Solder paste viscosity and particles: The viscosity of the solder paste should be moderate, too viscous or too thin will affect the crawling tin. The uniformity and size of the paste particles also affect the printing performance, generally recommended that the diameter of the paste particles for the stencil mesh size of 1 / 5, the maximum diameter can not be greater than 0.05mm. Solder paste warming and mixing: Solder paste should be sufficiently warmed and stirred before use to e...