SZFitech

 Conductive adhesive, an adhesive that exhibits specific conductive properties after curing or drying, its unique conductive properties and a wide range of application scenarios make it an important and indispensable material in the electronics industry. I. In-depth analysis of the principle of electrical conductivity The conductive properties of conductive adhesives are mainly due to their internal conductive particles.Before the adhesive is cured or dried, these particles are in a discrete state and do not form a continuous contact with each other, so the whole is insulated.However, when the conductive adhesive through the curing or drying process, the solvent gradually evaporate, the adhesive volume contraction, the distance between the conductive particles to be closer, and then form a stable continuous state, thus showing the conductive properties. Specifically, the conductive principle of conductive adhesives can be attributed to two main effects: Contact conduct...

 1. Overview of the bridging phenomenon Bridging in QFN packages is particularly common between the inner rows of solder joints in double-row QFNs, and relatively rare in single-row QFNs.Bridging occurs when solder is pressed against a non-wetted surface, which usually results in an electrical short that can seriously affect the performance and reliability of a circuit.As shown in the figure below. 2. Causes Solder Extrusion: The bottom of the QFN package has a large heat-sink pad that determines the height of the solder seam.Instead of printing the solder paste on the heat sink pad in a monolithic pattern, it is usually windowed or striped to vent and control voids in the solder seam.However, this design reduces the area covered by the solder paste and reduces the total amount of solder paste.When QFN reflow collapses, the pin solder squeezes outward, easily triggering bridging. QFN Deformation: Deformation of QFN package is also one of the causes of bridge connect...

 There are various ways to prepare fine solder powder, and five commonly used methods are described below: I. Gas atomisation method Principle: The molten liquid flowing through the nozzle is broken up and atomised into fine droplets using a high speed airflow. The droplets are cooled and solidified during the settling process to form powder particles, which are sorted to obtain ultra-fine tin powder. Features: High crushing efficiency and high output. The products are mostly oval, with rough surface, high oxygen content and wide powder size distribution. Nitrogen consumption is high and costly. Satellite ball sticking band is serious, particle size sorting is difficult. II. Centrifugal atomisation method Principle: Using the centrifugal force generated by the high-speed rotation of the turntable, the molten metal droplets are thrown out and atomised into powder, which is cooled and solidified to obtain ultra-micro tin powder after sorting. Features: The product has good sphe...

 LGA (Land Grid Array) is the use of the device body pad as the solder side of the components, under the BTC device, and QFN similar. LGA has no pins and solder balls, and is susceptible to device and PCB deformation, as the body covers the solder, making it difficult for bubbles to escape from the solder joint and increasing the likelihood of bubbles. Inspection of LGA solder joint quality usually requires the use of X-ray, 5D X-ray or 3D X-ray, with 3D X-ray (CT) inspection being the most intuitive and effective. LGA device failure types For LGA devices, the common failure problems are mainly short circuit and solder joint bubbles. These problems are related to the heavier devices; solder joint bubbles have a wide variety of causes, from device characteristics leading to voids are mainly caused by BTC devices. Process Difficulties and Failures of Super Heavy LGA Devices Some LGA devices are heavy, even with metal cases. Under the effect of gravity, the melted solder...

 Fluxes do play a vital role in the manufacturing industry, especially in the electronics manufacturing industry.There are many of its well-known brands, each of which occupies a place in the market by virtue of its unique advantages and characteristics.Below are some of the well-known flux brands and their characteristics: 1. Fitech co.ltd Corporate Strength: Fitech specialises in the research, development and production of microelectronic and semiconductor packaging materials and has a complete product line. Product features: Fitech's flux products are known for their high quality and performance, and are widely used in microelectronic packaging field.Its fluxes, such as FNC-3120, have excellent wettability and fluidity, are suitable for high-precision soldering scenarios, and focus on environmental performance. 2. Japan Senju Industry position: Japan Senju, as the absolute leading company in the encapsulated solder world, is also excellent in flux. The main featur...

  As the most prestigious annual event in the semiconductor industry across Southeast Asia, SEMICON SEA 2025 will take place at the Singapore Sands Convention and Exhibition Centre from May 20–22, 2025. SZ FItech, a leading global supplier of soldering materials, a dedicated key player in the microelectronics and semiconductor packaging field for over 20 years, will showcase four innovative products and solutions, including FWS305 water-soluble solder paste. These products are manifestation of SZ F i tech 's technological accumulation over the years and will facilitate to bring breakthrough solutions to the global advanced packaging field, supporting technological upgrade and development of advanced packaging.   We sincerely invite all semiconductor professions from around the world to visit our booth B1423 , exchanging information and sparking inspiration on the latest developments in packaging technology, innovative applications of materials, and market tre...

 Solder pastes can expire. The shelf life of solder pastes generally ranges from 6 months to 1 year, with finer ultra-micro solder pastes or epoxy pastes having a somewhat broken shelf life of 3-6 months storage life. The specific shelf life can be affected by a variety of factors, including manufacturer's labelling, storage conditions and frequency of use. Factors affecting shelf life Production date and manufacturer labelling: the shelf life of the solder paste will first be based on the manufacturer's label to determine, usually in the product packaging is clearly marked with the date of production and shelf life. Storage conditions: The storage conditions of solder paste have a significant impact on its shelf life. Generally speaking, solder paste should be sealed and stored in a cooler with constant temperature and humidity, with the temperature set between 2℃ and 8℃. If the storage temperature is too high, the alloy powder and flux in the solder paste may a...

 With the advent of the "post-Moore era", heterogeneous integration based on small chips will become the mainstream of semiconductor packaging. Small chips tend to be packaged in 3D directions to achieve flexible modular integration and system-on-chip integration. It should be considered that 3D packaging will bring some problems. For example, high-power electronic components often dissipate large amounts of heat during use, which requires a high melting point solder to maintain the thermal stability of the interconnect. However, the interconnection of some heat-sensitive components requires low-temperature solder. Some of these substrates have high heat sensitivity and cannot withstand high temperatures and prolonged heating in reflow ovens. Laser soldering can be used as an alternative soldering process due to its localized and non-contact heating, rapid temperature changes, and no need for flux. Experimental design The rapid temperature change and short solde...