The Effect of Metal Segregation on the Reliability of Welded Joints
Metal segregation is a common phenomenon in the welding process, which refers to the inhomogeneous chemical composition distribution in the metal alloy. Some scholars have studied the influence of interface microstructure in crack growth, pointed out that the growth rate of fatigue cracks along the solder interface is related to the stress released with the aging time. In a long period of high-temperature aging, such as aging at 140 ° C 7 ~ 30 days, due to the Sn in the solder near the interface with the base metal Cu metallurgical reaction to form CuSn intermetallic compounds in the process of consuming Sn, and thus in the immediate vicinity of the interface of the IMC to form a continuous Pb-rich phase region and cause Pb segregation, as shown in Figure. Figure 1. Pb segregation Sequestration affects the reliability and performance of solder joints in the following ways. Impact on solder joint mechanical properties Metal segregation results in inhomogene...