Analyzing SAC305 solder paste and its function

 SAC305 solder paste is a lead-free solder, specially developed to adapt to the environmental requirements and meet the RoHS and REACH requirements of the European Union. It is mainly composed of tin-silver-copper alloy (containing 96.5% tin, 3% silver and 0.5% copper) and flux, the melting temperature of the alloy is 217 degrees Celsius, and it is recommended for lead-free soldering by JEIDA (Japan Electronics Industry Development Association).

SAC305 solder paste has a variety of features and advantages. First of all, its flux paste system is specially developed for lead-free solder (SnAgCu system), with moderate solder paste activity and good wettability, as opposed to medium and high temperature solder pastes, which have traditional rosin resin-based solder paste products. At the same time, our company has developed an epoxy resin or silicone resin instead of rosin resin epoxy-type solder paste, referred to as tin glue. The process of using this type of solder paste is the same as that of solder paste. After reflow, the alloy powder molten tin pad metallurgical connection occurs, the resin glue solidified into a thermosetting adhesive, attached to the solder joints around, play a cleaning-free, reinforcement and increase the role of electrical properties. Tin glue is a new type of electronic packaging materials, can form a good wetting effect and solder joint strength in the soldering process. Secondly, SAC305 solder paste has excellent stability and can be used continuously or inter-segmentally for a long time in high temperature and high humidity environments to maintain good performance. In addition, it also has good printability and anti-slumping, good printing molding, excellent anti-tin streak resistance, low post-soldering solder joint voiding rate, and high soldering reliability.

SAC305 solder paste has a wide range of uses and is particularly suitable for use as a no-clean solder paste in the SMT (surface mount technology) process. It can be used in a variety of processes such as jetting, dispensing and laser soldering, and the overall fluidity has been specifically designed to meet the requirements of different products and processes. In addition, SAC305 solder paste has attracted much attention for its soldering effect on copper substrates, as it can react with Cu substrates to generate Cu6Sn5 IMC, thus enhancing the reliability of soldering.

Next, I recommend Fu Yingda SAC305 solder paste, which has good thermal conductivity, electrical conductivity, high roundness of the powder particles, ultra-micro size, particle size distribution is narrow, with T5 ~ T9 different particle size models of the ultra-micro solder paste products, suitable for different pitch packages. In the field of IC encapsulation, it can provide fine mechanical and electrical connections for precision IC chips, and at the same time provide physical protection for IC chips, its unique formula and manufacturing process to ensure that the welding process is smooth so that IC chips have a stable and reliable operating environment. If you are interested, please feel free to come to communicate and negotiate!

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